The First Batch of HY SOLAR's 40μm Ultra-Thin Silicon Wafers Rolls Off the Production Line, Setting a New Industry Record

Technological Leap Creates New-Quality Productive Forces for Silicon Wafers

As one of China’s earliest photovoltaic cutting equipment suppliers, HY SOLAR has been deeply engaged in the photovoltaic equipment field for over two decades. Its grinding, rounding, and slicing equipment once captured over 70% of the market share, while its silicon carbide cutting equipment achieved the first “domestic substitution,” holding over 60% market share at its peak. HY SOLAR’s ultra-thin silicon wafer cutting equipment continues to lead the industry. The company’s extensive experience in equipment R&D and its independent design capabilities for complete machines have laid a solid foundation for this latest breakthrough in ultra-thin silicon wafer technology.

Relying on its high-end equipment innovation platform, HY SOLAR continues to drive systematic innovations in cutting processes, core components, and intelligent control systems. Through compact axle-distance structural design and ultra-low tension adjustable technology, the equipment achieves higher operating speeds while maintaining wire web stability. At the process level, it employs the industry’s finest tungsten wire diamond lines and the smallest groove spacing solutions, effectively reducing kerf loss and increasing the number of wafers produced per kilogram of silicon. To meet the stringent requirements of ultra-thin wafers for precision and consistency, HY SOLAR has implemented dynamic tension precision control, optimized wire routing systems, and designed low-stress cutting paths, combined with refined cooling and edge protection processes. This significantly reduces wire vibration, stress fluctuations, and the risk of micro-cracks, while simultaneously supporting both full-size and half-cut wafer processing. This forms a comprehensive ultra-thin silicon wafer manufacturing capability covering all dimensional specifications.

Meanwhile, the deep integration of online monitoring, intelligent feedback, and process databases, along with full self-control over core guide wheels, spindle systems, and control modules, ensures long-term stable operation of the equipment under various dimensional and material conditions. HY SOLAR is progressively building a systematic technological advantage centered on “finer wires, higher precision, lower stress, and greater intelligence,” providing replicable and sustainable equipment support for the stable mass production of 40μm ultra-thin silicon wafers.

HY SOLAR's monocrystalline silicon wafers drive efficiency improvements through large-size and thin-wafer designs, achieving ultra-low control of oxygen and carbon content, along with high minority carrier lifetime and excellent resistivity uniformity. These features enable deep compatibility with diverse application needs. At the same time, the full range of wafers has obtained French ECS carbon footprint certification, demonstrating industry-leading performance metrics and environmental attributes.

HY SOLAR is deeply integrating its robust expertise in high-end equipment manufacturing with cutting-edge silicon material processes. This integration significantly enhances production line efficiency, product consistency, and yield performance, thereby accelerating the development of future-oriented core competitiveness in large-scale production processes.

The energy system is advancing into a new phase characterized by higher efficiency, lighter weight, and stronger reliability, which undoubtedly imposes more stringent demands on the performance thresholds of core materials. Leveraging the combined advantages of reduced thickness, lighter weight, and enhanced flexibility, HY SOLAR's self-developed ultra-thin silicon wafers can achieve better conformity on non-planar structures such as curved and arched surfaces, while significantly reducing system weight. This meets the requirements for lightweight and flexible applications, continuously expanding new scenarios for photovoltaic use and laying a solid foundation for diverse future applications.